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Beryllium Copper Wire 0.01-0.4MM for Ultrasonic Bonding

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Beryllium Copper Wire 0.01-0.4MM for Ultrasonic Bonding

Name: Beryllium Copper Wire 00104MM for Ultrasonic Bonding
Brand: WINNER
Price: 999 USD

Quality Beryllium Copper Wire 0.01-0.4MM for Ultrasonic Bonding for sale

Brand Name : WINNER

Model Number : BC010

Certification : ISO9100

Place of Origin : CHINA

MOQ : 1PC

Price : 999

Payment Terms : L/C, Western Union, T/T Supply Ability

Supply Ability : 100000 rolls per month

Delivery Time : 5-8 WORKING DAYS

Packaging Details : Roll, Neutrial Packing or with OEM LOGO

Application : Wire bonding

Bond Strength : High

Bonding Method : Ultrasonic

Surface Finish : Bright

Production Method : Drawing

Package : Spool

Purity : 99.999%

Length : 100 meters

Melting Point : 1064 degrees Celsius

Length Meters : 500/1000

Wire Diameter : 0.001 inches

Product Type : Bonding Wire

Coating Thickness : 0.001mm

Material : Copper

Coating : Berullium

Corrosion Resistance : High

Temperature Range : -40°C to 200°C

Conductivity : 98%

Package Size : 100 meters

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Product Description

Our Beryllium Copper (BeCu) Wire offers the perfect combination of strength, durability, and conductivity, making it the ideal choice for upgrading and enhancing modern electronic devices. With its exceptional mechanical performance, thermal conductivity, and electrical stability, BeCu wire is widely used in demanding industries such as semiconductors, telecommunications, aerospace, and precision electronics.

Unlike conventional copper wire, Beryllium Copper Wire provides superior tensile strength, excellent fatigue resistance, and long service life, ensuring reliability even in harsh or high-load environments. Whether for connectors, relays, springs, sensors, or microelectronic components, our BeCu wire delivers stable performance and durability that you can trust.

Beryllium Copper Wire 0.01-0.4MM for Ultrasonic Bonding

Product Tags:

Ultrasonic Bonding Beryllium Copper Wire

0.4MM Beryllium Copper Wire

Beryllium Copper Wire 0.01-0.4MM for Ultrasonic Bonding Images

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