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SICHUAN WINNER SPECIAL ELECTRONIC MATERIALS CO., LTD.
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Good Arc Share Au Gold and Ag Alloy Bonding Wire for Packaging TR ICs

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Good Arc Share Au Gold and Ag Alloy Bonding Wire for Packaging TR ICs

Brand Name : WINNER

Model Number : MW001

Certification : ISO9100

Place of Origin : CHINA

MOQ : 1PC

Price : 999

Payment Terms : L/C,Western Union,T/T

Supply Ability : 100000 rolls per month

Delivery Time : 5-8 WORKING DAYS

Packaging Details : Roll, Neutrial Packing or with OEM LOGO

Application : Semiconductor Packaging, Microelectronics, Medical Devices

Package : Spool

Corrosion Resistance : High

Material : Gold

Length Meters : 500/1000

Product Type : Bonding Wire

Coating : Gold

Bonding Method : Ultrasonic

Temperature Range : -40°C to 200°C

Surface Finish : Bright

Conductivity : 98%

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Gold Bonding Wire Au99.99% - 100m Per Spool (0.025mm Diameter)
High purity 99.99% (4N) fine gold wire for scientific research, medical, aerospace, and electrical applications. Offers excellent electrical properties and low reactivity for stability in harsh environments.
Material Gold
Diameter 0.0125, 0.05, etc. mm
Form Wire
Purity ≥99.99%
Gold wire provides exceptional electrical conductivity and durability, making it ideal for precision applications requiring stability in demanding conditions. Available in round or ribbon form, pure or mixed with beryllium for semiconductor applications.
Medical Applications
  • Electrosurgery equipment
  • Guide wires and stents
  • Life-support devices
  • Medical markers for X-rays (provides radiopacity)
  • CV therapies
  • In vitro diagnostic devices
Aerospace Applications
  • Wire-wound potentiometers
  • Aerospace instrumentation (avionics)
  • Radio communication equipment
  • Temperature regulation sensors
Electrical Applications
  • Imaging devices and televisions
  • Smartphones and computers
  • LED technology
  • Orthodontic appliances
  • Wire bonding for integrated circuits
  • Motherboard connections and microprocessor mounting
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Good Arc Share Au Gold and Ag Alloy Bonding Wire for Packaging TR ICs
Good Arc Share Au Gold and Ag Alloy Bonding Wire for Packaging TR ICs
Good Arc Share Au Gold and Ag Alloy Bonding Wire for Packaging TR ICs
Good Arc Share Au Gold and Ag Alloy Bonding Wire for Packaging TR ICs

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Quality Good Arc Share Au Gold and Ag Alloy Bonding Wire for Packaging TR ICs for sale

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